As silicon-based image sensors get wider and deeper into daily life, they provide extra views of this world to our eyes. Temporal resolution higher than 30 fps (frame per second) and resolution better than 12,000 ppi (pixel per inch) are quite common to these low-cost image display. To the contrary, infrared image sensors, especially for the spectral range beyond 1200 nm, although applicable to residential and personal security, suffer from much higher cost (higher than NT 200,000 in typical) and much lower resolution. (smaller than 1,200 ppi in typical). This project will carry out the first and the highest format (960×540) and the smallest size (7.8 μm) micro-LED array for demonstration; the smallest size (7.8 μm) micro-PD array for demonstration, and the first array-level Up-conversion wafer for image. The output of this project will contribute the technologies of high-resolution micro-LED array, micro-PD array, and Up-conversion wafer, which will have the applications of infrared camera, visible and infrared vehicle-use display.